修改于:
七月 07,2021
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供应商零件编号:
TIM_Silicone_Free
名称: Silicone Free Thermal Gap Filler 说明:
Laird gap filler pads are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance.
Laird’s silicone gap filler product lines includes:
Products ranging from 1-34 W/mk Thermal conductivity
Tflex SF600
Tflex SF800
Tflex SF10
Tflex HP34
Industries:
Consumer Electronics
Automotive
Telecom
Data Infrastructure
Industrial
Aerospace & Defense
Website Link: Product Catalog Page
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Thermal Conductivity (W/m-K):
Product Name:
Thickness (mm):
Width (mm):
Length (mm):
Part Number:
Tflex HP34,1.00 10.5x10.5mm
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Laird Technologies
Laird enables and protects the sensitive electronic components that power the world’s most sophisticated devices and machines. We partner with leading technology brands to deliver custom-engineered thermal interface materials, microwave absorbers, precision metals, EMC components, and EMI suppression solutions. Our product portfolio enhances the performance and reliability of electronics, including wearable devices, personal computers, servers, MRI machines, automobiles, 5G base stations, smart meters and much more.
Laird Technologies 16401 Swingley Ridge Road Suite 700
Chesterfield , Missouri , 63017 United States
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