说明
The PowerTab package has been designed to fill the gap in the market between the TO-247, more expensive metal case devices and non-isolated power modules. It is the natural replacement for metal case outlines such as DO-203AA and DO-203AB, but it is also suitable for new innovative solutions, thanks to a package outline that combines low profile, excellent die to footprint ratio and sturdy connectivity. It utilises a large lead for high current connection, carrying both a mounting hole and PCB insertion pins. The body is compatible with a TO-218 outline, with an exposed heatsink and non-isolated mounting hole.*Outline conform to JEDEC® TO-275 except cathode plate width. The cathode is a short contact, the anode is a long one (datasheet).